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The SINIC-TCK solder paste inspection SPI is a large-slab single-track high-speed three-dimensional tin cultivation inspection system with PSLM PMP Programmable Phase Profile Modulation Measurement Technology and an ultra-high frame rate high-precision industrial camera. It is designed to provide superior accuracy, reliability, and speed for solder paste inspection, ensuring that all components are in compliance with industry standards. It is a powerful tool for manufacturing and quality assurance, allowing for quick and easy inspection of solder paste applications.
KOHYOUNG solder paste inspection KY-SPI is the perfect choice for precise and stable detection. It utilizes unique SPI technology of 2D+3D technology for accurate and reliable results. KY-SPI is easy to use and provides fast and accurate detection of solder paste, ensuring maximum efficiency and quality assurance. It is the perfect choice for any solder paste inspection needs.
TRI TR70070 online 3D SPI is based on the latest 3D projection technology. Provides industry-leading inspection accuracy. It can be applied to various harsh process environments. The TR70070 online inspection system can automatically optimize the inspection route to provide the best performance. And TRI's innovative intelligent bending compensation system can compensate for the bending of the inspection process. You can choose dual-light source or four-light source digital fringe projection inspection. This is a product that provides a variety of solder paste inspection solutions, allowing you to fully grasp the excellent performance of high precision and high speed.
