huang696@126.com
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The SINIC-TCK solder paste inspection SPI is a large-slab single-track high-speed three-dimensional tin cultivation inspection system with PSLM PMP Programmable Phase Profile Modulation Measurement Technology and an ultra-high frame rate high-precision industrial camera. It is designed to provide superior accuracy, reliability, and speed for solder paste inspection, ensuring that all components are in compliance with industry standards. It is a powerful tool for manufacturing and quality assurance, allowing for quick and easy inspection of solder paste applications.